Principle Applications Engineer, 3DIC SI PI

We Are Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. You Are You have spent years in the trenches of signal and power integrity, running simulations that either catch a critical issue before tapeout or become a very expensive lesson learned. You know that the difference between a customer who adopts a tool and one who shelves it comes down to whether you can show them the value in their actual design, not a sanitized demo. You are comfortable walking into a room where you are the only one who understands both the physics and the software , and you can translate betwee n those worlds without losing either audience. Advanced packaging does not intimidate you because you have already debugged enough 3D IC designs to know where the problems hide. You have run HFSS or SIwave or Q3D enough times to develop instincts about what will converge and what will fight you. When a customer describes a problem, you are already thinking about which tool, which setup, and which tradeoffs will get them to an answer they can actually use . You do not need perfect requirements to move forward. You ask the right questions, set up the eval, and adjust as you learn more. At Synopsys, you will work with customers who are solving some of the hardest problems in semiconductor design, and what you show them will directly influence whether they can ship on time. What You'll Be Doing Engage directly with new and existing customers to understand their signal integrity, power integrity, and advanced packaging challenges, then demonstrate how Synopsys tools solve them in their specific design context Run multi-physics simulations using HFSS, SIwave , Q3D, Ansys, Clarity, or similar tools to validate product performance and guide customer evaluations Provide technical support and troubleshooting for customers working on 3D IC and advanced packaging designs, helping them set up models, interpret results, and optimize workflows Collaborate with product management and R&D teams to feed customer insights back into the roadmap and help prioritize feature development Travel to customer sites to conduct onsite evaluations, training sessions, and technical reviews, roughly 25% of the time Build and deliver technical presentations, application notes, and proof-of-concept demos that show measurable value in real customer scenarios Stay current on signal integrity, power integrity, and thermal analysis trends in advanced packaging and communicate those insights internally and externally The Impact You Will Have You will directly influence whether customers adopt Synopsys tools by showing them how to solve problems they could not solve before Your simulations and technical guidance will help customers catch design issues earlier, reducing costly respins and time to market The feedback you bring back from the field will shape product priorities and feature development, making the tools better for the next customer You will expand Synopsys footprint in advanced packaging by proving value in 3D IC, chiplet, and heterogeneous integration designs Your technical credibility will build long-term customer relationships that lead to broader tool adoption and renewals You will help customers navigate complex tradeoffs in signal integrity, power delivery, and thermal management, enabling them to ship more reliable products The evaluations and demos you run will become case studies and reference designs that accelerate adoption across other accounts What You'll Need Minimum 2 years of hands-on experience in 3D IC and advanced packaging design or analysis Proficiency with at least one of the following: HFSS, SIw