Applications Engineering, Staff Engineer

At Synopsys, we drive innovations that shape the way people work and live. As a member of the Applications Engineering team, you will work closely with semiconductor, advanced packaging, AI infrastructure, and electronics system customers to enable next-generation product development through simulation, digital engineering, and AI-driven workflows. This role combines deep engineering expertise, customer engagement, and solution consulting. You will help customers deploy industry-leading simulation technologies, engineering automation platforms, and AI-enabled design workflows to accelerate innovation across semiconductor packaging, AI servers, high-performance computing (HPC), and complex electronic systems. The ideal candidate possesses strong technical knowledge in simulation technologies, excellent communication skills, and practical experience working with semiconductor manufacturers, OSATs, or leading system companies. Key Responsibilities Technical Consulting & Customer Success Provide technical leadership and application support for simulation-driven design and engineering workflows. Work directly with customer engineering teams to understand design challenges and develop effective technical solutions. Deliver software evaluations, proof-of-concepts (PoCs), benchmarks, and customer demonstrations. Support strategic accounts and help customers maximize the value of Synopsys solutions. Drive customer adoption and deployment of advanced simulation methodologies. Semiconductor & Advanced Packaging Applications Support semiconductor and advanced packaging customers in solving complex thermo-mechanical and reliability challenges. Develop application methodologies for: Advanced Packaging CoWoS Chiplet Architectures Hybrid Bonding Fan-Out Packaging Heterogeneous Integration AI/HPC Package Development Conduct engineering studies related to: Warpage Prediction Thermo-Mechanical Reliability Stress Analysis Fatigue and Life Prediction Material Characterization Process-Induced Deformation AI-Driven Engineering & Workflow Automation Collaborate with customers to establish AI-powered engineering workflows and automation frameworks. Drive adoption of AI-assisted simulation and design optimization technologies. Support implementation of: Engineering Automation AI Agents for Engineering Applications Design Exploration Surrogate Modeling Machine Learning-based Optimization Digital Engineering Platforms Develop workflow automation solutions using scripting and programming tools such as Python. Multi-Physics Simulation & System Design Apply simulation technologies across: Structural Analysis Thermal Management Computational Fluid Dynamics (CFD) Vibration and Dynamic Analysis Electronics Cooling System-Level Engineering Assist customers in developing digital twin and model-based engineering methodologies. Cross-Functional Collaboration Work closely with R&D, Product Management, Sales, and Global Applications Engineering teams. Provide technical feedback and market requirements to product development organizations. Participate in customer visits, executive meetings, technical workshops, and industry conferences. Contribute to technical publications, best practices, and knowledge-sharing activities. Requirements Education M.S. or Ph.D. degree in: Mechanical Engineering Materials Science Aerospace Engineering Electrical Engineering Computer Engineering Applied Physics Related Engineering Disciplines Experience 5+ years of industry experience in semiconductor, advanced packaging, electronics systems, simulation software, or related engineering fields. Hands-on experience supporting engineering teams in semiconductor manufacturing, OSAT, IC design, HPC, AI server, electronics, or system development environments. Experience interacting with customers in technical consulting, application engineering, or solution deployment roles is highly preferred. Technical Qualifications Candidates should possess experience in one or more of the following areas: